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Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N

dc.contributor.authorPokhrel, Ankit
dc.contributor.authorGupta, Anshul
dc.contributor.authorKim, Min-Soo
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorSarkar, Sujan Kumar
dc.contributor.authorCanvel, Yann
dc.contributor.authorRenaud, Vincent
dc.contributor.authorKenens, Bart
dc.contributor.authorHodges, Blake
dc.contributor.authorJosephsen, Trent
dc.contributor.authorO'Neal, Sabine
dc.contributor.authorHerr, Quentin
dc.contributor.authorHerr, Anna
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2024-05-07T09:05:26Z
dc.date.available2023-08-07T17:07:24Z
dc.date.available2024-05-07T09:05:26Z
dc.date.issued2023
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001027381700021
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42289.3
dc.sourceWOS
dc.titleTowards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
dc.typeProceedings paper
dc.contributor.imecauthorPokhrel, Ankit
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorKim, Min-Soo
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorSarkar, Sujan Kumar
dc.contributor.imecauthorCanvel, Yann
dc.contributor.imecauthorRenaud, Vincent
dc.contributor.imecauthorKenens, Bart
dc.contributor.imecauthorHerr, Quentin
dc.contributor.imecauthorHerr, Anna
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecKim, Min-Soo::0000-0003-0211-0847
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecSarkar, Sujan Kumar::0000-0002-8471-6297
dc.contributor.orcidimecKenens, Bart::0000-0003-2329-5449
dc.contributor.orcidimecHerr, Quentin::0000-0002-6864-2603
dc.contributor.orcidimecHerr, Anna::0000-0001-9247-0090
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecPokhrel, Ankit::0009-0008-2524-3611
dc.contributor.orcidimecGupta, Anshul::0000-0003-4276-5397
dc.contributor.orcidimecCanvel, Yann::0009-0006-7501-9787
dc.contributor.orcidimecRenaud, Vincent::0009-0009-7686-4474
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154725
dc.identifier.eisbn979-8-3503-1097-9
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalN/A
imec.availabilityPublished - imec


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320.500.12860/42289.3*2024-05-07T09:03:01Zvalidation by library/open access desk
120.500.12860/422892023-08-07T17:07:24Z

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