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Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18

dc.contributor.authorMarti, Giulio
dc.contributor.authorPokhrel, Ankit
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorDelie, Gilles
dc.contributor.authorGupta, Anshul
dc.contributor.authorMarien, Philippe
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorDecoster, Stefan
dc.contributor.authorKundu, Souvik
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorOniki, Yusuke
dc.contributor.authorKenens, Bart
dc.contributor.authorHermans, Yannick
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2024-05-07T09:27:49Z
dc.date.available2023-08-07T17:07:24Z
dc.date.available2024-05-07T09:27:49Z
dc.date.issued2023
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001027381700011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42290.3
dc.sourceWOS
dc.titleTwo-level Semi-damascene interconnect with fully self-aligned Vias at MP18
dc.typeProceedings paper
dc.contributor.imecauthorMarti, Giulio
dc.contributor.imecauthorPokhrel, Ankit
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorDelie, Gilles
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorMarien, Philippe
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorKenens, Bart
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorHermans, Yannick
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecDelie, Gilles::0000-0002-5646-3261
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.contributor.orcidimecKenens, Bart::0000-0003-2329-5449
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecPokhrel, Ankit::0009-0008-2524-3611
dc.contributor.orcidimecGupta, Anshul::0000-0003-4276-5397
dc.contributor.orcidimecMarien, Philippe::0000-0001-5644-4442
dc.contributor.orcidimecKundu, Souvik::0000-0001-5815-8765
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154682
dc.identifier.eisbn979-8-3503-1097-9
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalN/A
imec.availabilityPublished - imec


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320.500.12860/42290.3*2024-05-07T09:25:24Zvalidation by library/open access desk
120.500.12860/422902023-08-07T17:07:24Z

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