dc.contributor.author | Marti, Giulio | |
dc.contributor.author | Pokhrel, Ankit | |
dc.contributor.author | Murdoch, Gayle | |
dc.contributor.author | Delie, Gilles | |
dc.contributor.author | Gupta, Anshul | |
dc.contributor.author | Marien, Philippe | |
dc.contributor.author | Lesniewska, Alicja | |
dc.contributor.author | Decoster, Stefan | |
dc.contributor.author | Kundu, Souvik | |
dc.contributor.author | Le, Quoc Toan | |
dc.contributor.author | Oniki, Yusuke | |
dc.contributor.author | Kenens, Bart | |
dc.contributor.author | Hermans, Yannick | |
dc.contributor.author | Park, Seongho | |
dc.contributor.author | Tokei, Zsolt | |
dc.date.accessioned | 2024-05-07T09:27:49Z | |
dc.date.available | 2023-08-07T17:07:24Z | |
dc.date.available | 2024-05-07T09:27:49Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2380-632X | |
dc.identifier.other | WOS:001027381700011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42290.3 | |
dc.source | WOS | |
dc.title | Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18 | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Marti, Giulio | |
dc.contributor.imecauthor | Pokhrel, Ankit | |
dc.contributor.imecauthor | Murdoch, Gayle | |
dc.contributor.imecauthor | Delie, Gilles | |
dc.contributor.imecauthor | Gupta, Anshul | |
dc.contributor.imecauthor | Marien, Philippe | |
dc.contributor.imecauthor | Lesniewska, Alicja | |
dc.contributor.imecauthor | Decoster, Stefan | |
dc.contributor.imecauthor | Kundu, Souvik | |
dc.contributor.imecauthor | Le, Quoc Toan | |
dc.contributor.imecauthor | Oniki, Yusuke | |
dc.contributor.imecauthor | Kenens, Bart | |
dc.contributor.imecauthor | Park, Seongho | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Hermans, Yannick | |
dc.contributor.orcidimec | Murdoch, Gayle::0000-0002-6833-220X | |
dc.contributor.orcidimec | Delie, Gilles::0000-0002-5646-3261 | |
dc.contributor.orcidimec | Lesniewska, Alicja::0000-0003-3863-065X | |
dc.contributor.orcidimec | Decoster, Stefan::0000-0003-1162-9288 | |
dc.contributor.orcidimec | Le, Quoc Toan::0000-0002-0206-6279 | |
dc.contributor.orcidimec | Oniki, Yusuke::0000-0002-6619-1327 | |
dc.contributor.orcidimec | Kenens, Bart::0000-0003-2329-5449 | |
dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
dc.contributor.orcidimec | Pokhrel, Ankit::0009-0008-2524-3611 | |
dc.contributor.orcidimec | Gupta, Anshul::0000-0003-4276-5397 | |
dc.contributor.orcidimec | Marien, Philippe::0000-0001-5644-4442 | |
dc.contributor.orcidimec | Kundu, Souvik::0000-0001-5815-8765 | |
dc.contributor.orcidimec | Hermans, Yannick::0000-0002-6973-0795 | |
dc.identifier.doi | 10.1109/IITC/MAM57687.2023.10154682 | |
dc.identifier.eisbn | 979-8-3503-1097-9 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM) | |
dc.source.conferencedate | MAY 22-25, 2023 | |
dc.source.conferencelocation | Dresden | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |