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Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages
dc.contributor.author | Chuang, Po-Yao | |
dc.contributor.author | Lorenzelli, Francesco | |
dc.contributor.author | Chakravarty, Sreejit | |
dc.contributor.author | Boutobza, Slimane | |
dc.contributor.author | Wu, Cheng-Wen | |
dc.contributor.author | Gielen, Georges | |
dc.contributor.author | Marinissen, Erik Jan | |
dc.date.accessioned | 2023-08-10T17:37:01Z | |
dc.date.available | 2023-08-10T17:37:01Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2164-0157 | |
dc.identifier.other | WOS:001021364700027 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42313 | |
dc.source | WOS | |
dc.title | Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Chuang, Po-Yao | |
dc.contributor.imecauthor | Lorenzelli, Francesco | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Chuang, Po-Yao::0000-0001-7325-8836 | |
dc.contributor.orcidimec | Lorenzelli, Francesco::0000-0001-6465-7157 | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.identifier.doi | 10.1109/3DIC57175.2023.10154900 | |
dc.identifier.eisbn | 979-8-3503-1137-2 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International 3D Systems Integration Conference (3DIC) | |
dc.source.conferencedate | MAY 10-12, 2023 | |
dc.source.conferencelocation | Cork | |
imec.availability | Under review |
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