EISBN
979-8-3503-1137-2
ISSN
2164-0157
Conference
IEEE International 3D Systems Integration Conference (3DIC)
Journal
2023 IEEE International 3D Systems Integration Conference (3DIC)
Title
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages
Publication type
Proceedings paper
Embargo date
9999-12-31