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HIPERPRINT= a board technology for high-frequency applications

dc.contributor.authorDe Baets, Johan
dc.contributor.authorVereeken, Maria
dc.contributor.authorVan Calster, Andre
dc.contributor.authorCorlatan, D.
dc.contributor.authorRaedschelders, E.
dc.contributor.authorPatra, G.
dc.contributor.authorMorrell, M.
dc.contributor.authorHaley, C.
dc.contributor.authorSchols, G.
dc.contributor.authorOstmann, A.
dc.contributor.authorMathelin, D.
dc.date.accessioned2021-10-14T12:47:01Z
dc.date.available2021-10-14T12:47:01Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4238
dc.sourceIIOimport
dc.titleHIPERPRINT= a board technology for high-frequency applications
dc.typeProceedings paper
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage326
dc.source.endpage332
dc.source.conferenceIMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
dc.source.conferencedate18/06/2000
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - open access


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