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An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology

dc.contributor.authorDe Pauw, Herbert
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Smet, Herbert
dc.contributor.authorZhang, S.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T12:49:19Z
dc.date.available2021-10-14T12:49:19Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4271
dc.sourceIIOimport
dc.titleAn MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology
dc.typeProceedings paper
dc.contributor.imecauthorDe Pauw, Herbert
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Smet, Herbert
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage557
dc.source.endpage562
dc.source.conferenceInternational Conference and Exhibition on High Density Interconnect and Systems Packaging; Aprl 2000; Denver, Co, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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