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Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems

dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorOssieur, Peter
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Asch, Jef
dc.contributor.authorZhang, Jing
dc.contributor.authorQin, Senbiao
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorVan Kerkhof, J.
dc.contributor.authorMilosevic, M. M.
dc.contributor.authorBakopoulos, P.
dc.contributor.authorSyrivelis, D.
dc.contributor.authorMentovich, E.
dc.contributor.authorMorozov, K.
dc.contributor.authorStracca, S.
dc.contributor.authorBigongiari, A.
dc.contributor.authorJoerg, T.
dc.contributor.authorSchlick, D.
dc.contributor.authorBraun, T.
dc.contributor.authorWoehrmann, M.
dc.contributor.authorGernhardt, R.
dc.contributor.authorCheng, Q.
dc.contributor.authorLi, T.
dc.contributor.authorPenty, R.
dc.date.accessioned2023-11-28T13:43:04Z
dc.date.available2023-10-23T17:27:29Z
dc.date.available2023-11-28T13:43:04Z
dc.date.issued2023
dc.identifier.issn0569-5503
dc.identifier.otherWOS:001047624100121
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42916.2
dc.sourceWOS
dc.titlePackaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems
dc.typeProceedings paper
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorOssieur, Peter
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Asch, Jef
dc.contributor.imecauthorZhang, Jing
dc.contributor.imecauthorQin, Senbiao
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecOssieur, Peter::0000-0002-8737-9142
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Asch, Jef::0000-0002-0784-1131
dc.contributor.orcidimecZhang, Jing::0000-0001-6608-9990
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.identifier.doi10.1109/ECTC51909.2023.00129
dc.identifier.eisbn979-8-3503-3498-2
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage742
dc.source.endpage747
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.journalna
imec.availabilityPublished - imec
dc.description.wosFundingTextThis work was supported by the European Union's Horizon Europe Research and Innovation Program under Agreement 101070560 (PUNCH).


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220.500.12860/42916.2*2023-11-28T13:36:06Zvalidation by library/open access desk
120.500.12860/429162023-10-23T17:27:29Z

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