dc.contributor.author | Van Steenberge, Geert | |
dc.contributor.author | Roelkens, Gunther | |
dc.contributor.author | Ossieur, Peter | |
dc.contributor.author | Missinne, Jeroen | |
dc.contributor.author | Van Asch, Jef | |
dc.contributor.author | Zhang, Jing | |
dc.contributor.author | Qin, Senbiao | |
dc.contributor.author | Van Campenhout, Joris | |
dc.contributor.author | Van Kerkhof, J. | |
dc.contributor.author | Milosevic, M. M. | |
dc.contributor.author | Bakopoulos, P. | |
dc.contributor.author | Syrivelis, D. | |
dc.contributor.author | Mentovich, E. | |
dc.contributor.author | Morozov, K. | |
dc.contributor.author | Stracca, S. | |
dc.contributor.author | Bigongiari, A. | |
dc.contributor.author | Joerg, T. | |
dc.contributor.author | Schlick, D. | |
dc.contributor.author | Braun, T. | |
dc.contributor.author | Woehrmann, M. | |
dc.contributor.author | Gernhardt, R. | |
dc.contributor.author | Cheng, Q. | |
dc.contributor.author | Li, T. | |
dc.contributor.author | Penty, R. | |
dc.date.accessioned | 2023-11-28T13:43:04Z | |
dc.date.available | 2023-10-23T17:27:29Z | |
dc.date.available | 2023-11-28T13:43:04Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:001047624100121 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42916.2 | |
dc.source | WOS | |
dc.title | Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van Steenberge, Geert | |
dc.contributor.imecauthor | Roelkens, Gunther | |
dc.contributor.imecauthor | Ossieur, Peter | |
dc.contributor.imecauthor | Missinne, Jeroen | |
dc.contributor.imecauthor | Van Asch, Jef | |
dc.contributor.imecauthor | Zhang, Jing | |
dc.contributor.imecauthor | Qin, Senbiao | |
dc.contributor.imecauthor | Van Campenhout, Joris | |
dc.contributor.orcidimec | Van Steenberge, Geert::0000-0001-8574-1235 | |
dc.contributor.orcidimec | Roelkens, Gunther::0000-0002-4667-5092 | |
dc.contributor.orcidimec | Ossieur, Peter::0000-0002-8737-9142 | |
dc.contributor.orcidimec | Missinne, Jeroen::0000-0002-3470-620X | |
dc.contributor.orcidimec | Van Asch, Jef::0000-0002-0784-1131 | |
dc.contributor.orcidimec | Zhang, Jing::0000-0001-6608-9990 | |
dc.contributor.orcidimec | Van Campenhout, Joris::0000-0003-0778-2669 | |
dc.identifier.doi | 10.1109/ECTC51909.2023.00129 | |
dc.identifier.eisbn | 979-8-3503-3498-2 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 742 | |
dc.source.endpage | 747 | |
dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
dc.source.conferencelocation | Orlando | |
dc.source.journal | na | |
imec.availability | Published - imec | |
dc.description.wosFundingText | This work was supported by the European Union's Horizon Europe Research and Innovation Program under Agreement 101070560 (PUNCH). | |