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An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem

dc.contributor.authorNoda, Hiroto
dc.contributor.authorHiro, Akito
dc.contributor.authorNishiguchi, Naoki
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-11-29T08:30:28Z
dc.date.available2023-10-23T17:27:42Z
dc.date.available2023-11-29T08:30:28Z
dc.date.issued2023
dc.identifier.issn0569-5503
dc.identifier.otherWOS:001047624100273
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42917.2
dc.sourceWOS
dc.titleAn Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.identifier.doi10.1109/ECTC51909.2023.00285
dc.identifier.eisbn979-8-3503-3498-2
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.beginpage1677
dc.source.endpage1681
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/42917.2*2023-11-29T08:29:08Zvalidation by library/open access desk
120.500.12860/429172023-10-23T17:27:42Z

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