dc.contributor.author | Noda, Hiroto | |
dc.contributor.author | Hiro, Akito | |
dc.contributor.author | Nishiguchi, Naoki | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2023-11-29T08:30:28Z | |
dc.date.available | 2023-10-23T17:27:42Z | |
dc.date.available | 2023-11-29T08:30:28Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:001047624100273 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42917.2 | |
dc.source | WOS | |
dc.title | An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.orcidimec | Slabbekoorn, John::0000-0002-6098-8618 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.identifier.doi | 10.1109/ECTC51909.2023.00285 | |
dc.identifier.eisbn | 979-8-3503-3498-2 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1677 | |
dc.source.endpage | 1681 | |
dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
dc.source.conferencelocation | Orlando | |
dc.source.journal | na | |
imec.availability | Published - imec | |