dc.contributor.author | Pinho, Nelson | |
dc.contributor.author | Chery, Emmanuel | |
dc.contributor.author | Bhatia, Ritwik | |
dc.contributor.author | Sundaram, Ganesh | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Krishtab, Mikhail | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2024-05-27T12:37:59Z | |
dc.date.available | 2023-10-24T17:34:31Z | |
dc.date.available | 2024-05-27T12:37:59Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:001047624100337 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42943.2 | |
dc.source | WOS | |
dc.title | Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Pinho, Nelson | |
dc.contributor.imecauthor | Chery, Emmanuel | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Krishtab, Mikhail | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Chery, Emmanuel::0000-0002-2526-3873 | |
dc.contributor.orcidimec | Slabbekoorn, John::0000-0002-6098-8618 | |
dc.contributor.orcidimec | Krishtab, Mikhail::0000-0001-6215-8506 | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Pinho, Nelson::0000-0002-0701-5921 | |
dc.identifier.doi | 10.1109/ECTC51909.2023.00350 | |
dc.identifier.eisbn | 979-8-3503-3498-2 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2040 | |
dc.source.endpage | 2045 | |
dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
dc.source.conferencelocation | Orlando | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |