Thermal and Mechanical characterization of embedded PTCQ packaging test chip die

Abstract

Heterogeneous integration in electronic packages require special attention on the interfaces between different materials. Embedded components utilize free space in isolating materials to integrate functions directly in the center of a substrate. Due to material differences, mechanical forces might apply on the electrical interconnection between the semiconductor and the package. An evaluation of the interface and a comparison to standard components shows that embedding enables further miniaturization and help to outperform traditional packaging technologies for a variety of operating conditions.