Show simple item record

Reliability analysis of flip chip assemblies mounted on BCB thin film layered substrates

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T12:51:53Z
dc.date.available2021-10-14T12:51:53Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4304
dc.sourceIIOimport
dc.titleReliability analysis of flip chip assemblies mounted on BCB thin film layered substrates
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage58
dc.source.endpage64
dc.source.conferenceIMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
dc.source.conferencedate18/06/2000
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
4288.pdf
Size:
775.4Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record