dc.contributor.author | Jacobs, Kristof J. P. | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2024-03-11T10:20:28Z | |
dc.date.available | 2023-12-02T16:54:11Z | |
dc.date.available | 2024-03-11T10:20:28Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0894-6507 | |
dc.identifier.other | WOS:001097335400023 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43207.2 | |
dc.source | WOS | |
dc.title | Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects | |
dc.type | Journal article | |
dc.contributor.imecauthor | Jacobs, Kristof J. P. | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Jacobs, Kristof J.P.::0000-0002-1081-3633 | |
dc.identifier.doi | 10.1109/TSM.2023.3311452 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 673 | |
dc.source.endpage | 675 | |
dc.source.journal | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | |
dc.source.issue | 4 | |
dc.source.volume | 36 | |
imec.availability | Published - imec | |