Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Articles
View item
imec Publications Repository
imec Publications
Articles
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects
Metadata
Show full item record
Authors
Jacobs, Kristof J. P.
;
Beyne, Eric
DOI
10.1109/TSM.2023.3311452
ISSN
0894-6507
Issue
4
Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume
36
Title
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects
Publication type
Journal article
Collections
Articles
Version history
Version
Item
Date
Summary
2
20.500.12860/43207.2
*
2024-03-11T10:19:26Z
validation by library/open access desk
1
20.500.12860/43207
2023-12-02T16:54:11Z
*Selected version
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login