| dc.contributor.author | Vanderstraeten, Emile | |
| dc.contributor.author | Vande Ginste, Dries | |
| dc.date.accessioned | 2024-03-06T09:45:04Z | |
| dc.date.available | 2023-12-29T17:25:19Z | |
| dc.date.available | 2024-01-09T10:37:02Z | |
| dc.date.available | 2024-03-06T09:45:04Z | |
| dc.date.issued | 2023 | |
| dc.identifier.issn | 2165-4107 | |
| dc.identifier.other | WOS:001108806900028 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43314.3 | |
| dc.source | WOS | |
| dc.title | Analysis of Electrostatically Induced Interconnect Structures in Single-Layer Graphene via a Conservative First-Principles Modeling Technique | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Vanderstraeten, Emile | |
| dc.contributor.imecauthor | Vande Ginste, Dries | |
| dc.contributor.orcidimec | Vanderstraeten, Emile::0000-0001-5189-388X | |
| dc.contributor.orcidimec | Vande Ginste, Dries::0000-0002-0178-288X | |
| dc.date.embargo | 9999-12-31 | |
| dc.identifier.doi | 10.1109/EPEPS58208.2023.10314906 | |
| dc.identifier.eisbn | 979-8-3503-1798-5 | |
| dc.source.numberofpages | 3 | |
| dc.source.peerreview | yes | |
| dc.source.conference | IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) | |
| dc.source.conferencedate | OCT 15-18, 2023 | |
| dc.source.conferencelocation | Milpitas | |
| dc.source.journal | / | |
| imec.availability | Published - imec | |
| dc.description.wosFundingText | The authors would like to thank Research Foundation - Flanders (FWO) for supporting this research (1107321N). | |
