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Evaluation of wafer bonding technology and the GaAs/Si spin-valve transistor

dc.contributor.authorDessein, Kristof
dc.contributor.authorAnil Kumar, P. S.
dc.contributor.authorLodder, J. C.
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorDelaey, L.
dc.contributor.authorDe Boeck, Jo
dc.date.accessioned2021-10-14T12:54:07Z
dc.date.available2021-10-14T12:54:07Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4331
dc.sourceIIOimport
dc.titleEvaluation of wafer bonding technology and the GaAs/Si spin-valve transistor
dc.typeMeeting abstract
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorDe Boeck, Jo
dc.source.peerreviewno
dc.source.beginpage23
dc.source.conferenceNEVAC / NNV Symposium "Toepassingen van Magnetische Nanostrukturen"
dc.source.conferencedate17/11/2000
dc.source.conferencelocationEindhoven The Netherlands
imec.availabilityPublished - imec


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