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The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

dc.contributor.authorDessein, Kristof
dc.contributor.authorAnil Kumar, P. S.
dc.contributor.authorNemeth, Stefan
dc.contributor.authorDelaey, L.
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorDe Boeck, Jo
dc.date.accessioned2021-10-14T12:54:12Z
dc.date.available2021-10-14T12:54:12Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4332
dc.sourceIIOimport
dc.titleThe vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures
dc.typeOral presentation
dc.contributor.imecauthorNemeth, Stefan
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorDe Boeck, Jo
dc.source.peerreviewno
dc.source.conference11th International Conference on Molecular Beam Epitaxy - MBE-XI; 10-15 September 2000; Bejing, China.
dc.source.conferencelocation
imec.availabilityPublished - imec


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