dc.contributor.author | Wei, Wei | |
dc.contributor.author | Zhang, Lei | |
dc.contributor.author | Tobback, Bert | |
dc.contributor.author | Visker, Jakob | |
dc.contributor.author | Stakenborg, Tim | |
dc.contributor.author | Karve, Gauri | |
dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.date.accessioned | 2024-08-29T08:15:13Z | |
dc.date.available | 2024-04-14T16:53:35Z | |
dc.date.available | 2024-08-29T08:15:13Z | |
dc.date.issued | 2024 | |
dc.identifier.issn | 1084-6999 | |
dc.identifier.other | WOS:001174201100293 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43827.2 | |
dc.source | WOS | |
dc.title | DEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Wei, Wei | |
dc.contributor.imecauthor | Zhang, Lei | |
dc.contributor.imecauthor | Tobback, Bert | |
dc.contributor.imecauthor | Visker, Jakob | |
dc.contributor.imecauthor | Stakenborg, Tim | |
dc.contributor.imecauthor | Karve, Gauri | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.orcidimec | Wei, Wei::0000-0002-1635-0924 | |
dc.contributor.orcidimec | Zhang, Lei::0000-0002-7405-6352 | |
dc.contributor.orcidimec | Stakenborg, Tim::0000-0001-9878-9078 | |
dc.contributor.orcidimec | Karve, Gauri::0009-0002-7316-5917 | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.identifier.doi | 10.1109/MEMS58180.2024.10439543 | |
dc.identifier.eisbn | 979-8-3503-5792-9 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1150 | |
dc.source.endpage | 1153 | |
dc.source.conference | 37th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) | |
dc.source.conferencedate | JAN 21-25, 2024 | |
dc.source.conferencelocation | Austin | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors gratefully acknowledge financial supports. This work is part of the Moore4Medical project funded by the ECSEL Joint Undertaking under the grant number H2020-EXCEL-2019-IA-876190. Authors also thank Geert Langenus, Geert Schoofs Glen Maes and Hans Dusar for their contributions to the fabrication process. | |