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DEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER

dc.contributor.authorWei, Wei
dc.contributor.authorZhang, Lei
dc.contributor.authorTobback, Bert
dc.contributor.authorVisker, Jakob
dc.contributor.authorStakenborg, Tim
dc.contributor.authorKarve, Gauri
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2024-08-29T08:15:13Z
dc.date.available2024-04-14T16:53:35Z
dc.date.available2024-08-29T08:15:13Z
dc.date.issued2024
dc.identifier.issn1084-6999
dc.identifier.otherWOS:001174201100293
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43827.2
dc.sourceWOS
dc.titleDEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER
dc.typeProceedings paper
dc.contributor.imecauthorWei, Wei
dc.contributor.imecauthorZhang, Lei
dc.contributor.imecauthorTobback, Bert
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorStakenborg, Tim
dc.contributor.imecauthorKarve, Gauri
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecWei, Wei::0000-0002-1635-0924
dc.contributor.orcidimecZhang, Lei::0000-0002-7405-6352
dc.contributor.orcidimecStakenborg, Tim::0000-0001-9878-9078
dc.contributor.orcidimecKarve, Gauri::0009-0002-7316-5917
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.identifier.doi10.1109/MEMS58180.2024.10439543
dc.identifier.eisbn979-8-3503-5792-9
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.beginpage1150
dc.source.endpage1153
dc.source.conference37th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
dc.source.conferencedateJAN 21-25, 2024
dc.source.conferencelocationAustin
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors gratefully acknowledge financial supports. This work is part of the Moore4Medical project funded by the ECSEL Joint Undertaking under the grant number H2020-EXCEL-2019-IA-876190. Authors also thank Geert Langenus, Geert Schoofs Glen Maes and Hans Dusar for their contributions to the fabrication process.


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220.500.12860/43827.2*2024-08-29T08:13:51Zvalidation by library/open access desk
120.500.12860/438272024-04-14T16:53:35Z

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