dc.contributor.author | Ahar, Ayyoub | |
dc.contributor.author | Vandecasteele, Mathieu | |
dc.contributor.author | Booth, Brian | |
dc.contributor.author | De Grave, Kurt | |
dc.contributor.author | Verhees, Dries | |
dc.contributor.author | Philips, Wilfried | |
dc.contributor.author | Bey-Temsamani, Abdellatif | |
dc.date.accessioned | 2024-08-26T09:49:25Z | |
dc.date.available | 2024-05-21T17:02:33Z | |
dc.date.available | 2024-08-26T09:49:25Z | |
dc.date.issued | 2024 | |
dc.identifier.isbn | 978-1-5106-7012-9 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.other | WOS:001209594200006 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43949.3 | |
dc.source | WOS | |
dc.title | Combining High-Throughput Imaging in Visible and SWIR wavelengths for In-Situ Porosity Prediction in Laser Powder Bed Fusion | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandecasteele, Mathieu | |
dc.contributor.imecauthor | Philips, Wilfried | |
dc.contributor.imecauthor | Booth, Brian | |
dc.contributor.orcidimec | Vandecasteele, Mathieu::0000-0001-8346-131X | |
dc.contributor.orcidimec | Philips, Wilfried::0000-0003-4456-4353 | |
dc.contributor.orcidimec | Booth, Brian::0000-0001-9228-4810 | |
dc.date.embargo | 2024-03-12 | |
dc.identifier.doi | 10.1117/12.2692836 | |
dc.identifier.eisbn | 978-1-5106-7013-6 | |
dc.source.numberofpages | 13 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 1287607 | |
dc.source.conference | Conference on Laser 3D Manufacturing XI | |
dc.source.conferencedate | JAN 30-FEB 01, 2024 | |
dc.source.conferencelocation | San Francisco | |
dc.source.journal | Proceedings of SPIE | |
dc.source.volume | 12876 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This research is supported by the Flemish Innovation and Entrepreneurship Agency through the imec ICON research project MultipLICITY (HBC.2022.0094) and by Flanders Make (the strategic research center for the manufacturing industry) & imec (the international research & development organization, active in the fields of nanoelectronics and digital technologies). This research received partial funding from the Flemish Government under the "Onderzoeksprogramma Artificiele Intelligentie (AI) Vlaanderen" programme. We would like to express our gratitude to other partners of the project consortium for their assistance in technical discussions including Flanders MAKE@KU Leuven; Materialise; imec Vision Lab, University of Antwerp; Dekimo; Manufacturing Processes and Systems (MaPS)@KU Leuven; Xenics; Rejig; and AdditiveLab. | |