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Modelling the influence of pad bending on the planarization performance during CMP

dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeuris, Marc
dc.contributor.authorVrancken, Evi
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDevriendt, Katia
dc.contributor.authorFyen, Wim
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T13:01:19Z
dc.date.available2021-10-14T13:01:19Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4403
dc.sourceIIOimport
dc.titleModelling the influence of pad bending on the planarization performance during CMP
dc.typeProceedings paper
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage45
dc.source.endpage50
dc.source.conferenceChemical-Mechanical Polishing - Fundamentals and Challenges
dc.source.conferencedate5/04/1999
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 566


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