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Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminum metallisations

dc.contributor.authorHeyvaert, Ilse
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.contributor.authorSaerens, Annelies
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBender, Hugo
dc.date.accessioned2021-10-14T13:04:07Z
dc.date.available2021-10-14T13:04:07Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4429
dc.sourceIIOimport
dc.titleEffect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminum metallisations
dc.typeJournal article
dc.contributor.imecauthorHeyvaert, Ilse
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBender, Hugo
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.source.peerreviewno
dc.source.beginpage291
dc.source.endpage299
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume50
imec.availabilityPublished - imec


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