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Modelling differential via holes

dc.contributor.authorLaermans, Eric
dc.contributor.authorDe Geest, Jan
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorOlyslager, Frank
dc.contributor.authorSercu, Stefaan
dc.contributor.authorMorlion, D.
dc.date.accessioned2021-10-14T13:12:11Z
dc.date.available2021-10-14T13:12:11Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4500
dc.sourceIIOimport
dc.titleModelling differential via holes
dc.typeProceedings paper
dc.contributor.imecauthorLaermans, Eric
dc.contributor.imecauthorDe Zutter, Daniel
dc.contributor.orcidimecLaermans, Eric::0000-0002-1811-9419
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage127
dc.source.endpage130
dc.source.conferenceProceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP; 23-25 October 2000; Scotts
dc.source.conferencedate23/10/2000
dc.source.conferencelocationScottsdale, AZ USA
imec.availabilityPublished - open access


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