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Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper

dc.contributor.authorWang, Lili
dc.contributor.authorPak, Murat
dc.contributor.authorPinho, Nelson
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2025-04-16T08:48:23Z
dc.date.available2025-02-15T21:13:56Z
dc.date.available2025-04-16T08:48:23Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.otherWOS:001340802800046
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45207.2
dc.sourceWOS
dc.titleSemi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper
dc.typeProceedings paper
dc.contributor.imecauthorWang, Lili
dc.contributor.imecauthorPak, Murat
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPak, Murat::0009-0002-5784-619X
dc.contributor.orcidimecPinho, Nelson::0000-0002-0701-5921
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ESTC60143.2024.10712041
dc.identifier.eisbn979-8-3503-9036-0
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/45207.2*2025-04-16T08:47:33Zvalidation by library/open access desk
120.500.12860/452072025-02-15T21:13:56Z

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