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IMC Assisted Die-bonding for Stacked Device Integration

dc.contributor.authorMaehara, Masataka
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGerets, Carine
dc.contributor.authorCochet, Tom
dc.contributor.authorCuypers, Dieter H.
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2025-04-16T08:29:37Z
dc.date.available2025-02-15T21:13:59Z
dc.date.available2025-04-16T08:29:37Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.otherWOS:001340802800010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45213.2
dc.sourceWOS
dc.titleIMC Assisted Die-bonding for Stacked Device Integration
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorCuypers, Dieter H.
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ESTC60143.2024.10712004
dc.identifier.eisbn979-8-3503-9036-0
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThis work was supported in mainly part by IMEC in Belgium. We extend our gratitude to many members in 3D program and Core CMOS activity at IMEC.


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220.500.12860/45213.2*2025-04-16T08:28:30Zvalidation by library/open access desk
120.500.12860/452132025-02-15T21:13:59Z

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