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Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic

dc.contributor.authorIraci, Sara
dc.contributor.authorPokhrel, Ankit
dc.contributor.authorPerez Lozano, Daniel
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorSarkar, Sujan Kumar
dc.contributor.authorSaroj, Rajendra Kumar
dc.contributor.authorCanvel, Yann
dc.contributor.authorRenaud, Vincent
dc.contributor.authorWalke, Amey
dc.contributor.authorKenens, Bart
dc.contributor.authorHodges, Blake
dc.contributor.authorIbrahim, Seifallah
dc.contributor.authorJosephsen, Trent
dc.contributor.authorHuet, Benjamin
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorKim, Min-Soo
dc.contributor.authorO'Neal, Sabine
dc.contributor.authorHerr, Quentin
dc.contributor.authorHerr, Anna
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2025-06-17T12:25:52Z
dc.date.available2025-03-06T20:46:06Z
dc.date.available2025-06-17T12:25:52Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001411360600022
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45328.2
dc.sourceWOS
dc.titleTwo Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic
dc.typeProceedings paper
dc.contributor.imecauthorIraci, Sara
dc.contributor.imecauthorPokhrel, Ankit
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorSarkar, Sujan Kumar
dc.contributor.imecauthorSaroj, Rajendra Kumar
dc.contributor.imecauthorCanvel, Yann
dc.contributor.imecauthorRenaud, Vincent
dc.contributor.imecauthorKenens, Bart
dc.contributor.imecauthorHodges, Blake
dc.contributor.imecauthorHuet, Benjamin
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorKim, Min-Soo
dc.contributor.imecauthorHerr, Anna
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorPerez Lozano, Daniel
dc.contributor.imecauthorWalke, Amey
dc.contributor.orcidimecIraci, Sara::0009-0006-1899-8210
dc.contributor.orcidimecPokhrel, Ankit::0009-0008-2524-3611
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecSarkar, Sujan Kumar::0000-0002-8471-6297
dc.contributor.orcidimecSaroj, Rajendra Kumar::0000-0002-3684-5959
dc.contributor.orcidimecCanvel, Yann::0009-0006-7501-9787
dc.contributor.orcidimecRenaud, Vincent::0009-0009-7686-4474
dc.contributor.orcidimecKenens, Bart::0000-0003-2329-5449
dc.contributor.orcidimecHuet, Benjamin::0000-0003-4084-5705
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecKim, Min-Soo::0000-0003-0211-0847
dc.contributor.orcidimecHerr, Anna::0000-0001-9247-0090
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecPerez Lozano, Daniel::0000-0003-3098-3266
dc.contributor.orcidimecWalke, Amey::0000-0001-8406-8122
dc.identifier.doi10.1109/IITC61274.2024.10732342
dc.identifier.eisbn979-8-3503-8517-5
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextWork at imec VZW and imec USA is supported by imec INVEST+ and by Osceola County Florida. The authors would also like to acknowledge the support of imec's FAB team.


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220.500.12860/45328.2*2025-06-17T12:22:17Zvalidation by library/open access desk
120.500.12860/453282025-03-06T20:46:06Z

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