Silicide induced mechanical stress in Si: what are the consequences for MOS technology
dc.contributor.author | Maex, Karen | |
dc.contributor.author | Steegen, An | |
dc.date.accessioned | 2021-10-14T13:19:00Z | |
dc.date.available | 2021-10-14T13:19:00Z | |
dc.date.issued | 2000 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4553 | |
dc.source | IIOimport | |
dc.title | Silicide induced mechanical stress in Si: what are the consequences for MOS technology | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Maex, Karen | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 143 | |
dc.source.endpage | 149 | |
dc.source.conference | Thin Films - Stresses and Mechanical Properties VIII | |
dc.source.conferencedate | 29/11/1999 | |
dc.source.conferencelocation | Boston, MA USA | |
imec.availability | Published - open access | |
imec.internalnotes | MRS Symposium Proceedings; Vol. 594 |