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High-frequency measurement techniques for characterization of electronic packaging

dc.contributor.authorMartens, Luc
dc.date.accessioned2021-10-14T13:20:39Z
dc.date.available2021-10-14T13:20:39Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4566
dc.sourceIIOimport
dc.titleHigh-frequency measurement techniques for characterization of electronic packaging
dc.typeOral presentation
dc.contributor.imecauthorMartens, Luc
dc.contributor.orcidimecMartens, Luc::0000-0001-9948-9157
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference9th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP
dc.source.conferencedate22/10/2000
dc.source.conferencelocationScottsdale, AZ USA
imec.availabilityPublished - open access
imec.internalnotesShort Course # 7


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