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Thin film polymer layers for molded smart cards, CIMID technology

dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorChristiaens, Filip
dc.contributor.authorRoggen, Jean
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeermann, M.
dc.contributor.authorGouwy, G.
dc.date.accessioned2021-09-29T12:39:51Z
dc.date.available2021-09-29T12:39:51Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/46
dc.sourceIIOimport
dc.titleThin film polymer layers for molded smart cards, CIMID technology
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceDow's 3rd MCM Workshop
dc.source.conferencedate21/09/1994
dc.source.conferencelocationBaden Baden Germany
imec.availabilityPublished - open access


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