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Reliability characterization of thermal micro-structures implemented on 0.8 mu m CMOS chips

dc.contributor.authorSheng, L. Y.
dc.contributor.authorDe Tandt, Cathleen
dc.contributor.authorRanson, Willy
dc.contributor.authorVounckx, Roger
dc.date.accessioned2021-10-14T13:46:11Z
dc.date.available2021-10-14T13:46:11Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4741
dc.sourceIIOimport
dc.titleReliability characterization of thermal micro-structures implemented on 0.8 mu m CMOS chips
dc.typeProceedings paper
dc.contributor.imecauthorVounckx, Roger
dc.source.peerreviewno
dc.source.beginpage112
dc.source.endpage117
dc.source.conference2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual;
dc.source.conferencelocation
imec.availabilityPublished - imec


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