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Electroless nickel plating bath composition and replenishment for microvia plating process

dc.contributor.authorStoukatch, Serguei
dc.contributor.authorZhang, S.
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVereeken, Maria
dc.contributor.authorVan Calster, Andre
dc.contributor.authorVandecasteele, Bjorn
dc.date.accessioned2021-10-14T13:51:29Z
dc.date.available2021-10-14T13:51:29Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4775
dc.sourceIIOimport
dc.titleElectroless nickel plating bath composition and replenishment for microvia plating process
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage447
dc.source.endpage452
dc.source.conferenceIMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
dc.source.conferencedate18/06/2000
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - open access


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