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Packaging for MEMS and MST devices: the indent reflow sealing method

dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T13:54:29Z
dc.date.available2021-10-14T13:54:29Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4794
dc.sourceIIOimport
dc.titlePackaging for MEMS and MST devices: the indent reflow sealing method
dc.typeProceedings paper
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage108
dc.source.endpage111
dc.source.conferenceProceedings of the International Conference and Exhibition on High Density Interconnect and System Packaging - HDI
dc.source.conferencedate25/04/2000
dc.source.conferencelocationDenver, CO USA
imec.availabilityPublished - open access


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