CIMID, a technology for high density integration of electronic systems

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Authors
Beyne, Eric; Van Hoof, Rita; Roggen, Jean; Van Puymbroeck, Jan; Heermann, M.; Gouwy, G.; Bulcke, F.
Conference
Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies
Title
CIMID, a technology for high density integration of electronic systems
Publication type
Oral presentation
Embargo date
9999-12-31
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