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Thermal fatigue reliability optimisation of flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T14:09:24Z
dc.date.available2021-10-14T14:09:24Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4885
dc.sourceIIOimport
dc.titleThermal fatigue reliability optimisation of flip chip assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage165
dc.source.endpage177
dc.source.conferenceBenefiting from Thermal and Mechanical Simulation in Microelectronics
dc.source.conferencedate23/03/2000
dc.source.conferencelocationEindhoven The Netherlands
imec.availabilityPublished - open access
imec.internalnotesEuroSimE Workshop


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