Mixed assembly of PCB using a novel flip-chip technology

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Authors

Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandamme, Lorenz; Allaert, K.

Issue

5

Journal

Advancing Microelectronics

Volume

27

Title

Mixed assembly of PCB using a novel flip-chip technology

Publication type

Journal article

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