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Mixed assembly of PCB using a novel flip-chip technology

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVan Calster, Andre
dc.contributor.authorCriel, Steven
dc.contributor.authorWillems, Geert
dc.contributor.authorDe Langhe, Pascal
dc.contributor.authorVandamme, Lorenz
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-10-14T14:09:46Z
dc.date.available2021-10-14T14:09:46Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4887
dc.sourceIIOimport
dc.titleMixed assembly of PCB using a novel flip-chip technology
dc.typeJournal article
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.source.peerreviewno
dc.source.beginpage28
dc.source.endpage30
dc.source.journalAdvancing Microelectronics
dc.source.issue5
dc.source.volume27
imec.availabilityPublished - imec


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