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Highlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applications

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVervaet, A.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T14:10:08Z
dc.date.available2021-10-14T14:10:08Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4889
dc.sourceIIOimport
dc.titleHighlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applications
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage315
dc.source.endpage318
dc.source.conferenceProceedings of the 23rd International Spring Seminar on Electronics Technology; May 2000; Balatonfured, Hungary.
dc.source.conferencelocation
imec.availabilityPublished - imec


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