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Modelling of thermal vias in high density interconnection structures

dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorBerghmans, J.
dc.date.accessioned2021-09-29T12:55:01Z
dc.date.available2021-09-29T12:55:01Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/488
dc.sourceIIOimport
dc.titleModelling of thermal vias in high density interconnection structures
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage110
dc.source.endpage114
dc.source.conference1st European Conference on Electronic Packaging Technology - EUPAC
dc.source.conferencedate01/02/1994
dc.source.conferencelocationEssen Germany
imec.availabilityPublished - open access
imec.internalnotesDVS Berichte; Vol. 158


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