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Chip package co-design of a 5GHz RF front-end for WLAN

dc.contributor.authorWambacq, Piet
dc.contributor.authorDonnay, Stephane
dc.contributor.authorPieters, Philip
dc.contributor.authorDiels, Wim
dc.contributor.authorVaesen, Kristof
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.date.accessioned2021-10-14T14:17:14Z
dc.date.available2021-10-14T14:17:14Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4930
dc.sourceIIOimport
dc.titleChip package co-design of a 5GHz RF front-end for WLAN
dc.typeProceedings paper
dc.contributor.imecauthorWambacq, Piet
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecWambacq, Piet::0000-0003-4388-7257
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage318
dc.source.endpage319
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate7/02/2000
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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