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Electro-conductive adhesives for high density package and flip-chip interconnections

dc.contributor.authorWojciechowski, Dominique
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorReese, E.
dc.contributor.authorHagedorn, H. W.
dc.date.accessioned2021-10-14T14:20:17Z
dc.date.available2021-10-14T14:20:17Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4947
dc.sourceIIOimport
dc.titleElectro-conductive adhesives for high density package and flip-chip interconnections
dc.typeJournal article
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage1215
dc.source.endpage1226
dc.source.journalMicroelectronics Reliability
dc.source.issue7
dc.source.volume40
imec.availabilityPublished - imec


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