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UTCS: ultra thin chip stacking a WSI emulation technology

dc.contributor.authorCoello-Vera, A.
dc.contributor.authorVendier, O.
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorPinel,
dc.contributor.authorBailbé, J.P.
dc.date.accessioned2021-10-14T14:26:59Z
dc.date.available2021-10-14T14:26:59Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4985
dc.sourceIIOimport
dc.titleUTCS: ultra thin chip stacking a WSI emulation technology
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage81
dc.source.endpage84
dc.source.conference3rd Round Table on Micro/Nano-Technologies for Space
dc.source.conferencedate15/05/2000
dc.source.conferencelocationNoordwijk The Netherlands
imec.availabilityPublished - imec
imec.internalnotesESA WPP 174


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