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A new ultra-thin 3D integration technique: technological and thermal investigations

dc.contributor.authorPinel, Stephane
dc.contributor.authorTasselli, Josiane
dc.contributor.authorMarty, Antoine
dc.contributor.authorBailbe, Jean-Pierre
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorMarco, Santiago
dc.contributor.authorLeseduarte, Sergio
dc.contributor.authorVendier, Olivier
dc.contributor.authorCoello Vera, Augustin
dc.date.accessioned2021-10-14T14:28:07Z
dc.date.available2021-10-14T14:28:07Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4991
dc.sourceIIOimport
dc.titleA new ultra-thin 3D integration technique: technological and thermal investigations
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage324
dc.source.endpage332
dc.source.conferenceDesign, Test, Integration, and Packaging of MEMS/MOEMS
dc.source.conferencedate9/05/2000
dc.source.conferencelocationParis France
imec.availabilityPublished - open access


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