Browsing Articles by imec author "2b1b9a40a5042a44aba1e9ff0f2fc7fa8aa8d32a"
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Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits
Haesevoets, Karel; Radisic, Alex; Vereecken, Philippe (2019) -
Low temperature deposition of 2D WS2 layers from WF6 and H2S precursors: Impact of reducing agents
Delabie, Annelies; Caymax, Matty; Groven, Benjamin; Heyne, Markus; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Bender, Hugo; Conard, Thierry; Verdonck, Patrick; Van Elshocht, Sven; De Gendt, Stefan; Heyns, Marc; Barla, Kathy; Radu, Iuliana; Thean, Aaron (2015) -
The Role of Benzotriazole in Electrodeposition of Cu1-xNix Alloys (0.05 < x < 0.15) on Cu and Ni Substrates
Haesevoets, Karel; Philipsen, Harold; Vereecken, Philippe (2022-05-05)