Browsing Articles by imec author "348fe30e81f3963be0ea3776b1f90c9d7d161262"
Now showing items 1-4 of 4
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Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2023) -
Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03) -
Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics
Vanstreels, Kris; Gonzalez, Mario; Salahouelhadj, Abdellah (2022-10-01) -
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Witters, Liesbeth; Zhang, Boyao; Seefeldt, Marc; Beyne, Eric; De Wolf, Ingrid (2022)