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Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
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Authors
Salahouelhadj, Abdellah
;
Gonzalez, Mario
;
Vanstreels, Kris
;
Van der Plas, Geert
;
Beyer, Gerald
;
Beyne, Eric
DOI
10.1016/j.mee.2023.111947
ISSN
0167-9317
Issue
March
Journal
MICROELECTRONIC ENGINEERING
Volume
271
Title
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Publication type
Journal article
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2
20.500.12860/41344.2
*
2023-07-07T08:16:20Z
validation by library/open access desk
1
20.500.12860/41344
2023-03-24T03:42:20Z
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