Browsing by author "Vanstreels, Kris"
Now showing items 1-20 of 175
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3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
Vanstreels, Kris; D'Olieslaeger, Marc; De Ceuninck, Ward; D'Haen, Jan; Maex, Karen (2005) -
A new method for the lifetime determination of submicron metal interconnects by means of parallel test structure
Vanstreels, Kris; D'Olieslaeger, Marc; De Ceuninck, Ward; D'Haen, Jan; Maex, Karen (2004) -
A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020) -
A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2016) -
Advanced experimental Back-End-Of-Line (BEOL) stability test: measurements and simulations
Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2015) -
Advanced experimental BEOL stability test: measurements and simulations
Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2014) -
Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young's modulus
Verdonck, Patrick; Wang, Cong; Le, Quoc Toan; Souriau, Laurent; Vanstreels, Kris; Krishtab, Mikhail; Baklanov, Mikhaïl (2014) -
Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus
Verdonck, Patrick; Wang, Cong; Souriau, Laurent; Vanstreels, Kris; Baklanov, Mikhaïl (2013) -
Aggressive scaling of Cu lowk: impact on metrology
Maex, Karen; Brongersma, Sywert; Iacopi, Francesca; Vanstreels, Kris; Travaly, Youssef; Baklanov, Mikhaïl; D'Haen, Jan; Beyer, Gerald (2005) -
Analysis and modeling of the high vacuum scanning spreading resistance microscopy nanocontact on silicon
Eyben, Pierre; Clemente, Francesca; Vanstreels, Kris; Pourtois, Geoffrey; Sankaran, Kiroubanand; Clarysse, Trudo; Mody, Jay; Duriau, Edouard; Hantschel, Thomas; Vandervorst, Wilfried; Mylvaganam, Kausala; Zhang, Liangchi (2010) -
Analysis and modeling of the HV-SSRM nanocontact on silicon
Eyben, Pierre; Clemente, Francesca; Vanstreels, Kris; Pourtois, Geoffrey; Sankaran, Kiroubanand; Clarysse, Trudo; Mody, Jay; Duriau, Edouard; Hantschel, Thomas; Vandervorst, Wilfried; Mylvaganam, Kausala; Zhang, Liangchi (2009) -
Analysis of the mechanical integrity of nano-interconnects; A novel approach inspired by composite mechanics
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2018) -
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2023) -
Anodic electrodeposition of continuous metal-organic framework films with robust adhesion by pre-anchored strategy
Guo, Wei; Monnens, Wouter; Zhang, Wei; Xie, Sijie; Han, Ning; Zhou, Zhenyu; Chanut, Nicolas; Vanstreels, Kris; Ameloot, Rob; Zhang, Xuan; Fransaer, Jan (2023) -
Assessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps
Vanstreels, Kris; De Wolf, Ingrid; Hangen, Ude (2013) -
Atomic layer deposition of ruthenium thin films from (ethylbenzyl) (1-ethyl-1,4-cyclohexadienyl) Ru: process characteristics, surface chemistry, and film properties
Popovici, Mihaela Ioana; Groven, Benjamin; Marcoen, Kristof; Phung, Quan; Dutta, Shibesh; Swerts, Johan; Meersschaut, Johan; Van den Berg, Jaap; Franquet, Alexis; Moussa, Alain; Vanstreels, Kris; Lagrain, Pieter; Bender, Hugo; Jurczak, Gosia; Van Elshocht, Sven; Delabie, Annelies; Adelmann, Christoph (2017) -
Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper
Wen, Liang Gong; Roussel, Philippe; Varela Pedreira, Olalla; Briggs, Basoene; Groven, Benjamin; Dutta, Shibesh; Popovici, Mihaela Ioana; Heylen, Nancy; Ciofi, Ivan; Vanstreels, Kris; Osterberg, Frederik; Hansen, Ole; Petersen, Dirch H.; Opsomer, Karl; Detavernie, Christophe; Wilson, Chris; Van Elshocht, Sven; Croes, Kristof; Bommels, Jurgen; Tokei, Zsolt; Adelmann, Christoph (2016-09) -
Bump pad design and its impact on the reliability of flip chip packages
Gonzalez, Mario; Lofrano, Melina; Vanstreels, Kris; Zahedmanesh, Houman; Beyne, Eric (2018) -
Challenges and solutions for chip package interaction
Vanstreels, Kris; Cherman, Vladimir; Zahedmanesh, Houman; De Wolf, Ingrid; Gonzalez, Mario (2015)