Browsing by author "Vanstreels, Kris"
Now showing items 21-40 of 175
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Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Characterization of 248nm deep ultraviolet (DUV) photoresist after ion implantation
Tsvetanova, Diana; Vos, Rita; Vereecke, Guy; Clemente, Francesca; Vanstreels, Kris; Conard, Thierry; Vogt, Tatjana; Mertens, Paul; Heyns, Marc (2009) -
Characterization of 248nm deep ultraviolet (DUV) photoresist after ion implantation
Tsvetanova, Diana; Vos, Rita; Vereecke, Guy; Clemente, Francesca; Vanstreels, Kris; Conard, Thierry; Parac-Vogt, Tatjana; Mertens, Paul; Heyns, Marc (2009) -
Characterization of Impact of Vertical Stress on FinFETs
Furuhashi, Takahisa; Haneda, Masaki; Sasaki, Toru; Kagawa, Yoshihisa; Ooka, Yutaka; Hirano, Tomoyuki; Ohno, Keiichi; Iwamoto, Hayato; Saito, Masaki; Liu, Yefan; Hiblot, Gaspard; Vanstreels, Kris; Gonzalez, Mario; Velenis, Dimitrios; Beyer, Gerald; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric (2019) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2012) -
Contact resistance modeling for NEMS ohmic relays using highly doped SiGe contact
Ramezani, Maliheh; Severi, Simone; Tamaddon, Amir-Hossein; Vanstreels, Kris; Tilmans, Harrie; Rottenberg, Xavier; De Meyer, Kristin; Witvrouw, Ann (2013) -
Continued scalability of copper/low-k interconnects
Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005) -
Copper deposition and subsequent grain structure evolution in narrow lines
Brongersma, Sywert; D'Haen, Jan; Vanstreels, Kris; De Ceuninck, Ward; Vervoort, Iwan; Maex, Karen (2003) -
Copper grain growth in reduced dimensions
Brongersma, Sywert; Vanstreels, Kris; Wu, W.; Zhang, Wenqi; Ernur, Didem; D'Haen, Jan; Terzieva, Valentina; Van Hove, Marleen; Clarysse, Trudo; Carbonell, Laure; Vandervorst, Wilfried; De Ceuninck, Ward; Maex, Karen (2004-06) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Degradation of 248nm deep UV photoresist by ion implantation
Tsvetanova, Diana; Vos, Rita; Vereecke, Guy; Parac-Vogt, Tatjana; Clemente, Francesca; Vanstreels, Kris; Radisic, Dunja; Conard, Thierry; Franquet, Alexis; Jivanescu, M.; Nguyen, D. A. P.; Stesmans, Andre; Brijs, Bert; Mertens, Paul; Heyns, Marc (2011) -
Delamination in BEOL: analysis of interface failure by combined experimental & modeling approaches
Debecker, Bjorn; Vanstreels, Kris; Gonzalez, Mario; Vandevelde, Bart (2013) -
Design and characterization of a monolithic system: polymer microneedle array on a polymer platform
Paul Chaudhuri, Buddhadev; Ceyssens, Frederik; Vanstreels, Kris; Gonzalez, Mario; La Manna, Antonio; Pereira Neves, Hercules; Van Hoof, Chris; Puers, Bob (2012) -
Determination of elastic properties of a MnO2 coating by SAW analysis
Sermeus, Jan; Rochan, Sinha; Vanstreels, Kris; Vereecken, Philippe; Glorieux, Christ (2014) -
Determination of mechanical and swelling properties of EPOCLAD negative photoresist
Wouters, Kristof; Vanstreels, Kris; Gijsenbergh, Pieter; Puers, Bob (2010) -
Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Baklanov, Mikhaïl (2016)