Publication:

Challenges and solutions for chip package interaction

Date

2015
Proceedings Paper
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Author(s)

Vanstreels, Kris  
;
Cherman, Vladimir  
;
Zahedmanesh, Houman  
;
De Wolf, Ingrid  
;
Gonzalez, Mario  

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Abstract

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1927 since deposited on 2021-10-23
Acq. date: 2026-09-19

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1927 since deposited on 2021-10-23
Acq. date: 2026-09-19

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