Publication:
Challenges and solutions for chip package interaction
Date
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Zahedmanesh, Houman | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Zahedmanesh, Houman | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-23T00:28:41Z | |
| dc.date.available | 2021-10-23T00:28:41Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26112 | |
| dc.identifier.url | https://www.nist.gov/sites/default/files/documents/pml/div683/conference/FCMN_CD.pdf | |
| dc.source.beginpage | 101 | |
| dc.source.conference | Frontiers of Characterization and Metrology for Nanoelectronics - FCMN | |
| dc.source.conferencedate | 14/04/2015 | |
| dc.source.conferencelocation | Dresden Germany | |
| dc.source.endpage | 103 | |
| dc.title | Challenges and solutions for chip package interaction | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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