Browsing by author "Salahouelhadj, Abdellah"

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)

Advances in temporary carrier technology for high density fan-out device build-up

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019)

An alternative 3D packaging route thru wafer reconstruction

Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015)

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2023)

Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03)

Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

De Vos, Joeri; Cherman, Vladimir; Detalle, Mikael; Wang, Teng; Salahouelhadj, Abdellah; Daily, Robert; Van der Plas, Geert; Beyne, Eric (2014)

CTE measurements for 3D package substrates using digital image correlation

Salahouelhadj, Abdellah; Gonzalez, Mario (2016)

Die thickness impact on thermo-mechanical stress in 3D packages

Salahouelhadj, Abdellah; Gonzalez, Mario; Oprins, Herman (2015)

Effects of packaging on mechanical stress in 3D-ICs

Cherman, Vladimir; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Van der Plas, Geert; De Vos, Joeri; Wang, Teng; Daily, Robert; Salahouelhadj, Abdellah; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2015)

Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

Salahouelhadj, Abdellah; Gonzalez, Mario; Podpod, Arnita; Beyne, Eric (2022)

Low warpage wafer level transfer molding post 3D die to wafer assembly

Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Potoms, Goedele; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Gal, Wilfred; Zijl, Jurrian; Kersjes, Sebastiaan; Wensink, Henk (2016)

Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics

Vanstreels, Kris; Gonzalez, Mario; Salahouelhadj, Abdellah (2022-10-01)

Process challenges during CVD oxide deposition on the backside of 20-Î¼m thin 300-mm wafers temporarily bonded to glass carriers.

Kennes, Koen; Guerrero, Alice; Salahouelhadj, Abdellah; Suhard, Samuel; Derakhshandeh, Jaber; Phommahaxay, Alain; Brems, Steven; Beyer, Gerald; Beyne, Eric (2023)