Publication:
Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges
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1915 since deposited on 2021-10-22
4last month
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Acq. date: 2026-05-01
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Statistics
Views
1915 since deposited on 2021-10-22
4last month
1last week
Acq. date: 2026-05-01
Citations