Authors

De Vos, Joeri; Cherman, Vladimir; Detalle, Mikael; Wang, Teng; Salahouelhadj, Abdellah; Daily, Robert; Van der Plas, Geert; Beyne, Eric

Conference

IEEE 3D Sytem Integration Conference - 3DIC

Title

Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

Publication type

Proceedings paper

Embargo date

9999-12-31