Publication:

Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

Date

2014
Proceedings Paper
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dc.contributor.authorDe Vos, Joeri
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDetalle, Mikael
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorDaily, Robert
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T01:11:09Z
dc.date.available2021-10-22T01:11:09Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23734
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7152146/?arnumber=7152146
dc.source.beginpage1
dc.source.conferenceIEEE 3D Sytem Integration Conference - 3DIC
dc.source.conferencedate1/12/2014
dc.source.conferencelocationKinsale Ierland
dc.source.endpage7
dc.title

Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

dc.typeProceedings paper
dspace.entity.typePublication
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